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WDS-700 BGA Soldering Station For Cell Phone Motherboard IC Repairing

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WDS-700 BGA Soldering Station For Cell Phone Motherboard IC Repairing

Brand Name : WDS

Model Number : WDS-700

Certification : CE

Place of Origin : China

MOQ : 1 UNIT

Payment Terms : T/T, Western Union, MoneyGram

Supply Ability : 150 UNITS PER MONTH

Delivery Time : 8-15 working days

Packaging Details : Wooden case

Power supply : AC 220V±10% 50/60Hz

Rated Capacity : 2600W

Rated Duty Cycle : 100

Voltage : 220V/110V

PCB size : Max 140*160mm Min 5*5 mm

Chip size : Max50*50mm Min1*1mm

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WDS-700 Mobile BGA Rework Station

Higher automatic function

Newest WDS-700 is the updated system with 5 modes.It’s Remove,Mount,Weld,Manual and Semi-auto.The mode can be changed freely.It can be used under automatic,semi-auto & manual mode.

WDS-700 BGA Soldering Station For Cell Phone Motherboard IC Repairing

Independent 2 heating zones temperature control system

1.The upper and lower hot air heating,which can heat up at the same time from the top of he component to the bottom of the PCB;temperature precision control within ±1℃.8 segment temperature control independently.

2.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysed,set and correct on the touch screen at any time.

WDS-700 BGA Soldering Station For Cell Phone Motherboard IC Repairing

Precision optical alignment system

Using high definition and adjustable CCD color optical alignment system,beam split,amplification,lessening,fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment,adjustable image contrast;equipped with 15 ” high definition LCD monitor.

WDS-700 BGA Soldering Station For Cell Phone Motherboard IC Repairing

Multi-functional and humanized operation system

1.Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement.

2.X,Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm.

WDS-700 BGA Soldering Station For Cell Phone Motherboard IC Repairing

Superior safety protection function

With the alarm function, after the BGA welding the machine can alarm by itself.In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any modification.

Technology parameter

1 Power supply AC 110V/220V±10% 50/60Hz
2 Total power Max 2400W
3 Heater power Upper temp.zone 1200W,second temp.zone 1200W
4 Electrical material Driving motor+PLC smart temp.controller+color touch screen
5 Temperature controlling (high precision K-sensor)(Closed Loop),independent temp.controller,the precision can reach ±1℃
6 Locating way V shape slot,PCB support jigs can adjust
7 PCB size Max 140*160mm Min 5*5 mm
8 Application chips Max 80*80mm,Min 1*1mm
9 Overall dimension L450×W470×H670mm
10 Temperature Interface 1 pcs
11 Weight of machine 30KG
12 Color White&blue

WDS-700 BGA Soldering Station For Cell Phone Motherboard IC Repairing


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